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Socket Adapters

Manufacturer	Series	Packaging	Part Status	Convert From (Adapter End)	Convert To (Adapter End)	Pitch - Mating	Contact Finish - Mating	Mounting Style	Termination	Pitch - Post	Number of Pins	Contact Finish - Post	Housing Material	Board Material
3M Analog Devices Inc./Maxim Integrated Aries Electronics Logical Systems Corp. MikroElektronika TE Connectivity DEUTSCH Connectors Xeltek	* - 647 Correct-A-Chip® Correct-A-Chip® 1106396 Correct-A-Chip® 1107254 Correct-A-Chip® 1109342 Correct-A-Chip® 1109522 Correct-A-Chip® 1109523 Correct-A-Chip® 1110087 Correct-A-Chip® 1110267-N Correct-A-Chip® 1111163 Correct-A-Chip® 1111841 Correct-A-Chip® 1111903 Correct-A-Chip® 301296 Correct-A-Chip® 301550 Correct-A-Chip® 304235 Correct-A-Chip® 304504 Correct-A-Chip® 304538 Correct-A-Chip® 305263 Correct-A-Chip® 305479 Correct-A-Chip® 307349 Correct-A-Chip® 350000 Correct-A-Chip® 351000 Correct-A-Chip® 352000 Correct-A-Chip® 353000 Correct-A-Chip® 354000 Correct-A-Chip® 354W00 Correct-A-Chip® 35W000 Correct-A-Chip® 450001 Correct-A-Chip® 505 Correct-A-Chip® 555000 Correct-A-Chip® 650000 Correct-A-Chip® 651000 Correct-A-Chip® 652000 Correct-A-Chip® 653000 Correct-A-Chip® 655000 Correct-A-Chip® 6645 Correct-A-Chip® 665000 Correct-A-Chip® 666000 Correct-A-Chip® 95-132I25 Correct-A-Chip® 96-160M65 Correct-A-Chip® 96-208M50 Correct-A-Chip® 97-56001 Correct-A-Chip® 97-68340 Correct-A-Chip® 97-AQ132D DS9075 DX Textool™	- Bag Box Bulk Retail Package Tube	Active Discontinued at InFortune Obsolete	- AT90PWM2 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing DIP, 0.8" (20.32mm) Row Spacing DIP, 0.9" (22.86mm) Row Spacing DIP, 1.0" (25.40mm) Row Spacing HB2E Relay MSOP Multiple Packages PLCC PQFP QFP SIP Socket, 0.6" (15.24mm) Row Spacing SOIC SOIC-W SOJ SOWIC SSOP TQFP TSOP VQFP	- DIP DIP, 0.3" (7.62mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing DIP, 0.8" (20.32mm) Row Spacing DIP, 0.9" (22.86mm) Row Spacing DIP, 1.0" (25.40mm) Row Spacing JEDEC PGA PLCC QFP SOIC SOWIC	- 0.020" (0.50mm) 0.024" (0.60mm) 0.025" (0.64mm) 0.026" (0.65mm) 0.031" (0.80mm) 0.050" (1.27mm) 0.070" (1.78mm) 0.100" (2.54mm)	- Gold Silver Tin Tin-Lead	- Surface Mount Through Hole	- Solder Wire Wrap	- 0.031" (0.80mm) 0.050" (1.27mm) 0.070" (1.78mm) 0.100" (2.54mm)	- 10 100 12 128 132 14 144 16 160 169 18 184 20 208 22 24 28 32 36 40 42 44 48 52 56 60 64 68 8 80 84 90	- Gold Tin Tin-Lead	- Polyamide (PA46), Nylon 4/6, Glass Filled Polyester Polyphenylene Sulfide (PPS) Polysulfone (PSU), Glass Filled	- FR4 Epoxy Glass Polyimide (PI)

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Mfr. Part #	Price	Quantity	Datasheet	Series	Packaging	Part Status	Convert From (Adapter End)	Convert To (Adapter End)	Pitch - Mating	Contact Finish - Mating	Mounting Style	Termination	Pitch - Post	Number of Pins	Contact Finish - Post	Housing Material	Board Material
800-37-6-1 ADAPTER TE Connectivity Deutsch Connectors	-	RFQ	Datasheet	-	Bag	Active	-	-	-	-	-	-	-	-	-	-	-
95-132I25 SOCKET ADAPTER QFP TO 132PGA Aries Electronics	-	RFQ	Datasheet	Correct-A-Chip® 95-132I25	Bulk	Active	QFP	PGA	0.025" (0.64mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	132	Tin-Lead	-	FR4 Epoxy Glass
96-160M65 SOCKET ADAPTER QFP TO 160PGA Aries Electronics	-	RFQ	Datasheet	Correct-A-Chip® 96-160M65	Bulk	Active	QFP	PGA	0.026" (0.65mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	160	Tin-Lead	-	FR4 Epoxy Glass
218-3341-09-0602J SOCKET ADAPTER 18DIP TO 18DIP 3M	-	RFQ	Datasheet	Textool™	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	18	Gold	Polysulfone (PSU), Glass Filled	-
96-208M50 SOCKET ADAPTER QFP TO 208PGA Aries Electronics	-	RFQ	Datasheet	Correct-A-Chip® 96-208M50	Bulk	Active	QFP	PGA	0.020" (0.50mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	208	Tin-Lead	-	FR4 Epoxy Glass
97-68340 SOCKET ADAPTER QFP TO 144PGA Aries Electronics	-	RFQ	Datasheet	Correct-A-Chip® 97-68340	Bulk	Active	QFP	PGA	0.026" (0.65mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	144	Tin	-	FR4 Epoxy Glass
44-305263-20 SOCKET ADAPTER QFP TO 44PLCC Aries Electronics	-	RFQ	Datasheet	Correct-A-Chip® 305263	Bulk	Active	QFP	PLCC	0.024" (0.60mm)	-	Through Hole	Solder	0.050" (1.27mm)	44	Tin-Lead	-	FR4 Epoxy Glass
14-354W00-10 CONN ADAPTER 14PIN DIP TO SOWIC Aries Electronics	-	RFQ	Datasheet	Correct-A-Chip® 354W00	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	SOWIC	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	14	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
16-354W00-10 CONN ADAPTER 16PIN DIP TO SOWIC Aries Electronics	-	RFQ	Datasheet	Correct-A-Chip® 354W00	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	SOWIC	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	16	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
20-354W00-10 CONN ADAPTER 20PIN DIP TO SOWIC Aries Electronics	-	RFQ	Datasheet	Correct-A-Chip® 354W00	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	SOWIC	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	20	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-354W00-10 CONN ADAPTER 24PIN DIP TO SOWIC Aries Electronics	-	RFQ	Datasheet	Correct-A-Chip® 354W00	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	SOWIC	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	24	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
228-1290-09-0602J RECEPTACLE DIP SOCKET 28POS .4" 3M	-	RFQ	Datasheet	Textool™	Box	Discontinued	DIP, 0.4" (10.16mm) Row Spacing	DIP, 0.4" (10.16mm) Row Spacing	0.070" (1.78mm)	Gold	Through Hole	Solder	0.070" (1.78mm)	28	Gold	Polysulfone (PSU), Glass Filled	-
228-1290-29-0602J RECEPTACLE DIP SOCKET 28POS .4" 3M	-	RFQ	Datasheet	Textool™	Box	Active	DIP, 0.4" (10.16mm) Row Spacing	DIP, 0.4" (10.16mm) Row Spacing	0.070" (1.78mm)	Gold	Through Hole	Solder	0.070" (1.78mm)	28	Gold	Polysulfone (PSU), Glass Filled	-
242-1281-09-0602J RECEPTACLE DIP SOCKET 42POS .6" 3M	-	RFQ	Datasheet	Textool™	Box	Active	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.6" (15.24mm) Row Spacing	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	42	Gold	Polysulfone (PSU), Glass Filled	-
242-1293-29-0602J RECEPTACLE DIP SOCKET 42POS .6" 3M	-	RFQ	Datasheet	Textool™	Box	Active	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.6" (15.24mm) Row Spacing	0.070" (1.78mm)	Gold	Through Hole	Solder	0.070" (1.78mm)	42	Gold	Polysulfone (PSU), Glass Filled	-
248-1282-19-0602J RECEPTACLE DIP SOCKET 48POS .6" 3M	-	RFQ	Datasheet	Textool™	Box	Active	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.6" (15.24mm) Row Spacing	0.100" (2.54mm)	Gold	Through Hole	Wire Wrap	0.100" (2.54mm)	48	Gold	Polysulfone (PSU), Glass Filled	-
264-1300-29-0602J RECEPTACLE DIP SOCKET 64POS .8" 3M	-	RFQ	Datasheet	Textool™	Box	Active	DIP, 0.8" (20.32mm) Row Spacing	DIP, 0.8" (20.32mm) Row Spacing	0.070" (1.78mm)	Gold	Through Hole	Solder	0.070" (1.78mm)	64	Gold	Polysulfone (PSU), Glass Filled	-
290-1294-09-0602J RECEPTACLE DIP SOCKET 90POS .9" 3M	-	RFQ	Datasheet	Textool™	Box	Active	DIP, 0.9" (22.86mm) Row Spacing	DIP, 0.9" (22.86mm) Row Spacing	0.070" (1.78mm)	Gold	Through Hole	Solder	0.070" (1.78mm)	90	Gold	Polysulfone (PSU), Glass Filled	-
48-6645-18 SOCKET ADAPTER TQFP TO 48DIP 0.6 Aries Electronics	-	RFQ	Datasheet	Correct-A-Chip® 6645	Bulk	Active	TQFP	DIP, 0.6" (15.24mm) Row Spacing	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	48	Tin-Lead	-	FR4 Epoxy Glass
18-350000-10-HT SOCKET ADAPTER SOIC TO 18DIP 0.3 Aries Electronics	-	RFQ	Datasheet	Correct-A-Chip® 350000	Bulk	Active	SOIC	DIP, 0.3" (7.62mm) Row Spacing	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	18	Tin-Lead	-	Polyimide (PI)

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