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BDN13-3CB/A01

BDN13-3CB/A01

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Manufacturer Part
BDN13-3CB/A01
Manufacturer
CTS Corporation
Description
HEATSINK CPU W/ADHESIVE 1.31"SQ
Category
Fans, Thermal Management
Family
Thermal - Heat Sinks
Series
-
InStock
5
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:BDN
Package:Box
Part Status:Active
Type:Top Mount
Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:Thermal Tape, Adhesive (Included)
Shape:Square, Pin Fins
Length:1.310" (33.27mm)
Width:1.310" (33.27mm)
Diameter:-
Fin Height:0.355" (9.02mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:6.00°C/W @ 400 LFM
Thermal Resistance @ Natural:16.10°C/W
Material:Aluminum
Material Finish:Black Anodized

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