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TS391LT50

TS391LT50

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Manufacturer Part
TS391LT50
Manufacturer
Chip Quik, Inc.
Description
THERMALLY STABLE SOLDER PASTE NO
Category
Soldering, Desoldering, Rework Products
Family
Solder
Series
-
InStock
51
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:-
Package:Bulk
Part Status:Active
Type:Solder Paste
Composition:Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter:-
Melting Point:281°F (138°C)
Flux Type:No-Clean
Wire Gauge:-
Process:Lead Free
Form:Jar, 1.76 oz (50g)
Shelf Life:12 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:68°F ~ 77°F (20°C ~ 25°C)

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