Type | Description |
---|---|
Series: | iCF |
Package: | Tube |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 8 (2 x 4) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Tin |
Contact Finish Thickness - Mating: | - |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Surface Mount |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Liquid Crystal Polymer (LCP) |
Operating Temperature: | -55°C ~ 125°C |
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714-43-137-31-018000Mill-Max |
CONN SOCKET SIP 37POS GOLD |
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CONN IC DIP SOCKET 20POS GOLD |
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