Type | Description |
---|---|
Series: | D0 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 16 (2 x 8) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Wire Wrap |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 196.9µin (5.00µm) |
Contact Material - Post: | Brass |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
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4820-3000-CP3M |
CONN IC DIP SOCKET 20POS TIN |
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299-83-312-10-001101Preci-Dip |
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114-83-628-41-117101Preci-Dip |
CONN IC DIP SOCKET 28POS GOLD |
In Stock: 0 $1.53340 |
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110-87-328-41-001101Preci-Dip |
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In Stock: 0 $0.62010 |
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346-93-159-41-013000Mill-Max |
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116-83-610-41-007101Preci-Dip |
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24-6574-11Aries Electronics, Inc. |
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121-83-320-41-001101Preci-Dip |
CONN IC DIP SOCKET 20POS GOLD |
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122-83-320-41-001101Preci-Dip |
CONN IC DIP SOCKET 20POS GOLD |
In Stock: 0 $1.45653 |
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210-99-320-41-001000Mill-Max |
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In Stock: 0 $12.00600 |