Type | Description |
---|---|
Series: | 116 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 22 (2 x 11) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Elevated, Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Brass |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
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116-87-640-41-012101Preci-Dip |
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123-43-628-41-001000Mill-Max |
CONN IC DIP SOCKET 28POS GOLD |
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116-83-650-41-008101Preci-Dip |
CONN IC DIP SOCKET 50POS GOLD |
In Stock: 0 $4.83753 |
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110-87-652-41-001101Preci-Dip |
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612-87-308-41-001101Preci-Dip |
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614-93-316-31-012000Mill-Max |
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