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| Type | Description |
|---|---|
| Series: | 518 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 10 (1 x 10) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | - |
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|---|---|---|---|
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110-13-632-41-801000Mill-Max |
CONN IC DIP SOCKET 32POS GOLD |
In Stock: 0 $17.04300 |
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123-93-950-41-001000Mill-Max |
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346-43-155-41-013000Mill-Max |
CONN SOCKET SIP 55POS GOLD |
In Stock: 0 $9.02000 |
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28-6518-101Aries Electronics, Inc. |
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In Stock: 0 $5.47182 |
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In Stock: 0 $15.77000 |
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110-93-652-41-105000Mill-Max |
CONN IC DIP SOCKET 52POS GOLD |
In Stock: 0 $16.90482 |
