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| Type | Description |
|---|---|
| Series: | 115 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 22 (2 x 11) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
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|---|---|---|---|
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117-93-430-41-005000Mill-Max |
CONN IC DIP SOCKET 30POS GOLD |
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In Stock: 0 $0.37080 |
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210-13-308-41-001000Mill-Max |
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116-83-308-41-004101Preci-Dip |
CONN IC DIP SOCKET 8POS GOLD |
In Stock: 0 $0.92669 |
