| Type | Description |
|---|---|
| Series: | 714 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.1" (2.54mm) Row Spacing |
| Number of Positions or Pins (Grid): | 36 (2 x 18) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Carrier, Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Brass Alloy |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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40-C182-11Aries Electronics, Inc. |
CONN IC DIP SOCKET 40POS GOLD |
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110-43-640-41-801000Mill-Max |
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116-87-610-41-004101Preci-Dip |
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116-87-636-41-007101Preci-Dip |
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123-83-648-41-001101Preci-Dip |
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24-4518-10Aries Electronics, Inc. |
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123-47-328-41-001000Mill-Max |
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110-99-308-41-001000Mill-Max |
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114-87-308-41-134161Preci-Dip |
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NTE436W16NTE Electronics, Inc. |
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