Type | Description |
---|---|
Series: | - |
Package: | Tray |
Part Status: | Obsolete |
Type: | LGA |
Number of Positions or Pins (Grid): | 1366 (32 x 41) |
Pitch - Mating: | 0.040" (1.02mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 15.0µin (0.38µm) |
Contact Material - Mating: | Copper Alloy |
Mounting Type: | Surface Mount |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.040" (1.01mm) |
Contact Finish - Post: | - |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Copper Alloy |
Housing Material: | Thermoplastic |
Operating Temperature: | - |
Image | Part Number | Description | Stock / Unit Price |
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CONN IC DIP SOCKET 24POS GOLD |
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CONN IC DIP SOCKET 20POS GOLD |
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CONN IC DIP SOCKET 8POS GOLD |
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CONN IC DIP SOCKET 20POS GOLD |
In Stock: 0 $0.00000 |
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A-CCS52-Z-SMASSMANN WSW Components |
CONN SOCKET PLCC 52POS TIN |
In Stock: 0 $0.00000 |
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2-641932-2TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD |
In Stock: 0 $0.00000 |
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A-CCS32-Z-RASSMANN WSW Components |
CONN SOCKET PLCC 32POS TIN |
In Stock: 0 $0.00000 |
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1571541-1TE Connectivity AMP Connectors |
CONN SOCKET PLCC 44POS TIN |
In Stock: 0 $0.00000 |