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| Type | Description |
|---|---|
| Series: | HF212 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 |
| Diameter: | - |
| Melting Point: | 408 ~ 424°F (209 ~ 218°C) |
| Flux Type: | No-Clean |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Jar, 17.64 oz (500g) |
| Shelf Life: | 6 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | - |
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