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| Type | Description |
|---|---|
| Series: | - |
| Package: | Jar |
| Part Status: | Active |
| Type: | Solder Paste |
| Composition: | Ag40Cu30Zn28Ni2 (40/30/28/2) |
| Diameter: | - |
| Melting Point: | 1220 ~ 1435°F (660 ~ 780°C) |
| Flux Type: | - |
| Wire Gauge: | - |
| Process: | Lead Free |
| Form: | Jar, 1 oz (28g) |
| Shelf Life: | 9 Months |
| Shelf Life Start: | Date of Manufacture |
| Storage/Refrigeration Temperature: | 41°F ~ 77°F (5°C ~ 25°C) |
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