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| Type | Description |
|---|---|
| Series: | 55 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 36 (2 x 18) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Nickel Boron |
| Contact Finish Thickness - Mating: | 50.0µin (1.27µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Nickel Boron |
| Contact Finish Thickness - Post: | 50.0µin (1.27µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
181-PRS18040-12Aries Electronics, Inc. |
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116-43-314-41-008000Mill-Max |
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160-PGM14029-40Aries Electronics, Inc. |
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In Stock: 0 $32.09667 |
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523-93-012-05-001003Mill-Max |
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SMPX-68LCC-NKycon |
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146-91-314-41-013000Mill-Max |
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546-83-192-14-001135Preci-Dip |
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612-43-964-41-004000Mill-Max |
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511-93-169-13-000001Mill-Max |
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In Stock: 0 $33.64800 |
