Type | Description |
---|---|
Series: | 57 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 24 (2 x 12) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Nickel Boron |
Contact Finish Thickness - Mating: | 50.0µin (1.27µm) |
Contact Material - Mating: | Beryllium Nickel |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Nickel Boron |
Contact Finish Thickness - Post: | 50.0µin (1.27µm) |
Contact Material - Post: | Beryllium Nickel |
Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature: | - |
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40-C182-21Aries Electronics, Inc. |
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116-43-316-41-008000Mill-Max |
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20-3508-212Aries Electronics, Inc. |
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