Type | Description |
---|---|
Series: | 510 |
Package: | Bulk |
Part Status: | Active |
Type: | PGA |
Number of Positions or Pins (Grid): | 225 (17 x 17) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Brass |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
Image | Part Number | Description | Stock / Unit Price |
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116-93-306-61-001000Mill-Max |
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In Stock: 0 $19.62597 |
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14-7500-10Aries Electronics, Inc. |
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22-81150-610CAries Electronics, Inc. |
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In Stock: 0 $13.13444 |
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551-10-241-18-075004Mill-Max |
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510-83-114-13-061101Preci-Dip |
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In Stock: 0 $4.54369 |
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558-10-352M26-001104Preci-Dip |
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114-43-322-41-117000Mill-Max |
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614-91-628-31-007000Mill-Max |
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12-7500-10Aries Electronics, Inc. |
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127-93-656-41-003000Mill-Max |
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