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| Type | Description |
|---|---|
| Series: | 55 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 44 (2 x 22) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | - |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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510-91-100-13-061001Mill-Max |
SOCKET SOLDERTAIL 100-PGA |
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42-6556-10Aries Electronics, Inc. |
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510-13-084-11-045001Mill-Max |
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510-93-155-18-121001Mill-Max |
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40-81150-610CAries Electronics, Inc. |
CONN IC DIP SOCKET 40POS GOLD |
In Stock: 0 $20.01800 |
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550-10-121-13-061101Preci-Dip |
PGA SOLDER TAIL |
In Stock: 0 $13.42222 |
