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520-AG11D-ESL

520-AG11D-ESL

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Manufacturer Part
520-AG11D-ESL
Manufacturer
TE Connectivity AMP Connectors
Description
CONN IC DIP SOCKET 20POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
7365
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:500
Package:Bulk
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):20 (2 x 10)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:-
Contact Material - Mating:Copper Alloy
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin-Lead
Contact Finish Thickness - Post:-
Contact Material - Post:Copper Alloy
Housing Material:Polyester
Operating Temperature:-55°C ~ 125°C

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