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| Type | Description |
|---|---|
| Series: | 55 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 36 (2 x 18) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Nickel Boron |
| Contact Finish Thickness - Mating: | 50.0µin (1.27µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Nickel Boron |
| Contact Finish Thickness - Post: | 50.0µin (1.27µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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558-10-272M20-001101Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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317-47-114-41-005000Mill-Max |
STANDRD SOLDRTL SNG SKT |
In Stock: 0 $12.67920 |
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612-43-316-41-001000Mill-Max |
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44-6573-10Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 44POS TIN |
In Stock: 0 $20.70667 |
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In Stock: 0 $17.02804 |
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In Stock: 0 $1.59572 |
