Type | Description |
---|---|
Series: | 57 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 42 (2 x 21) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Tin |
Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature: | - |
Image | Part Number | Description | Stock / Unit Price |
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19-0508-21Aries Electronics, Inc. |
CONN SOCKET SIP 19POS GOLD |
In Stock: 0 $13.22222 |
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124-43-642-41-002000Mill-Max |
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08-3508-30Aries Electronics, Inc. |
CONN IC DIP SOCKET 8POS GOLD |
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In Stock: 0 $4.46600 |
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511-13-088-12-052002Mill-Max |
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