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| Type | Description |
|---|---|
| Series: | 700 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 20 (1 x 20) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
| Contact Material - Mating: | Phosphor Bronze |
| Mounting Type: | Through Hole |
| Features: | Carrier, Elevated |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Phosphor Bronze |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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175-PGM16010-10Aries Electronics, Inc. |
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511-93-181-15-041001Mill-Max |
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515-13-289-17-000001Mill-Max |
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38-0508-20Aries Electronics, Inc. |
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