Type | Description |
---|---|
Series: | 0513 |
Package: | Bulk |
Part Status: | Active |
Type: | SIP |
Number of Positions or Pins (Grid): | 1 (1 x 1) |
Pitch - Mating: | - |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | - |
Termination: | Solder |
Pitch - Post: | - |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Brass |
Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature: | - |
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122-13-964-41-001000Mill-Max |
CONN IC DIP SOCKET 64POS GOLD |
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510-83-085-13-001101Preci-Dip |
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In Stock: 0 $0.87914 |
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110-91-306-61-001000Mill-Max |
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511-13-196-14-000001Mill-Max |
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18-81250-610CAries Electronics, Inc. |
CONN IC DIP SOCKET 18POS GOLD |
In Stock: 0 $10.26000 |
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126-91-306-41-002000Mill-Max |
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