Type | Description |
---|---|
Series: | 558 |
Package: | Bulk |
Part Status: | Active |
Type: | PGA |
Number of Positions or Pins (Grid): | 255 (16 x 16) |
Pitch - Mating: | 0.050" (1.27mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.050" (1.27mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Brass |
Housing Material: | FR4 Epoxy Glass |
Operating Temperature: | -55°C ~ 125°C |
Image | Part Number | Description | Stock / Unit Price |
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612-43-310-41-003000Mill-Max |
SKT CARRIER SOLDRTL |
In Stock: 0 $13.13763 |
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210-11-422-41-001000Mill-Max |
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551-90-289-17-000005Mill-Max |
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523-13-085-11-041002Mill-Max |
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124-41-628-41-002000Mill-Max |
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32-6508-211Aries Electronics, Inc. |
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126-93-952-41-002000Mill-Max |
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CONN IC DIP SOCKET 42POS GOLD |
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