| Type | Description |
|---|---|
| Series: | 510 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | 161 (14 x 14) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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08-6503-20Aries Electronics, Inc. |
CONN IC DIP SOCKET 8POS GOLD |
In Stock: 0 $3.80586 |
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36-6571-11Aries Electronics, Inc. |
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116-91-314-41-007000Mill-Max |
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110-43-632-41-605000Mill-Max |
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In Stock: 0 $13.98767 |
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511-93-032-09-041001Mill-Max |
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522-13-044-08-031003Mill-Max |
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