Type | Description |
---|---|
Series: | 518 |
Package: | Bulk |
Part Status: | Active |
Type: | PGA |
Number of Positions or Pins (Grid): | 560 (33 x 33) |
Pitch - Mating: | 0.050" (1.27mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | Flash |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Surface Mount |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.050" (1.27mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | Flash |
Contact Material - Post: | Brass |
Housing Material: | FR4 Epoxy Glass |
Operating Temperature: | -55°C ~ 125°C |
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515-93-100-13-061001Mill-Max |
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28-6621-30Aries Electronics, Inc. |
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50-9518-10TAries Electronics, Inc. |
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