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| Type | Description |
|---|---|
| Series: | 508 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.2" (5.08mm) Row Spacing |
| Number of Positions or Pins (Grid): | 6 (2 x 3) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Wire Wrap |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6 |
| Operating Temperature: | -55°C ~ 105°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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511-93-100-10-000003Mill-Max |
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32-9513-10TAries Electronics, Inc. |
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126-93-650-41-001000Mill-Max |
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ICO-624-SGTSamtec, Inc. |
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122-13-648-41-001000Mill-Max |
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CONN IC DIP SOCKET 28POS GOLD |
In Stock: 0 $12.58444 |
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08-8240-310CAries Electronics, Inc. |
CONN IC DIP SOCKET 8POS GOLD |
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38-1518-11HAries Electronics, Inc. |
CONN IC DIP SOCKET 38POS GOLD |
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126-93-632-41-003000Mill-Max |
CONN IC DIP SOCKET 32POS GOLD |
In Stock: 0 $17.40000 |
