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08-3503-21

08-3503-21

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Manufacturer Part
08-3503-21
Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET 8POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
9630
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:503
Package:Bulk
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Wire Wrap
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Phosphor Bronze
Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:-55°C ~ 125°C

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