Type | Description |
---|---|
Series: | 510 |
Package: | Tube |
Part Status: | Active |
Type: | PGA |
Number of Positions or Pins (Grid): | 69 (11 x 11) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | - |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Brass Alloy |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature: | -55°C ~ 125°C |
Image | Part Number | Description | Stock / Unit Price |
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08-81000-310CAries Electronics, Inc. |
CONN IC DIP SOCKET 8POS GOLD |
In Stock: 0 $5.91100 |
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115-93-306-41-003000Mill-Max |
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37-0518-00Aries Electronics, Inc. |
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511-91-168-17-105002Mill-Max |
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36-6553-18Aries Electronics, Inc. |
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24-8370-610CAries Electronics, Inc. |
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