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| Type | Description |
|---|---|
| Series: | 518 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 35 (1 x 35) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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40-3571-11Aries Electronics, Inc. |
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08-8550-210CAries Electronics, Inc. |
CONN IC DIP SOCKET 8POS GOLD |
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114-91-640-41-117000Mill-Max |
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115-44-318-61-003000Mill-Max |
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211-1-48-006CnC Tech |
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127-41-316-41-002000Mill-Max |
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24-3518-101Aries Electronics, Inc. |
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317-47-118-41-005000Mill-Max |
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