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| Type | Description |
|---|---|
| Series: | 55 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 44 (2 x 22) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Nickel Boron |
| Contact Finish Thickness - Mating: | 50.0µin (1.27µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Nickel Boron |
| Contact Finish Thickness - Post: | 50.0µin (1.27µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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30-0518-10HAries Electronics, Inc. |
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511-91-064-08-000001Mill-Max |
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126-91-318-41-002000Mill-Max |
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522-13-289-17-000003Mill-Max |
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511-93-084-13-081001Mill-Max |
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522-93-132-14-071001Mill-Max |
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In Stock: 0 $38.08720 |
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510-83-240-17-061101Preci-Dip |
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117-41-642-41-105000Mill-Max |
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