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| Type | Description |
|---|---|
| Series: | 55 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 24 (2 x 12) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Nickel Boron |
| Contact Finish Thickness - Mating: | 50.0µin (1.27µm) |
| Contact Material - Mating: | Beryllium Nickel |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Nickel Boron |
| Contact Finish Thickness - Post: | 50.0µin (1.27µm) |
| Contact Material - Post: | Beryllium Nickel |
| Housing Material: | Polyetheretherketone (PEEK), Glass Filled |
| Operating Temperature: | -55°C ~ 250°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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209-PGM17046-11Aries Electronics, Inc. |
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510-91-072-11-042003Mill-Max |
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117-43-668-61-005000Mill-Max |
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ICO-314-STTSamtec, Inc. |
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116-93-628-41-001000Mill-Max |
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In Stock: 0 $16.53929 |
