Type | Description |
---|---|
Series: | 605 |
Package: | Tube |
Part Status: | Active |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 52 (2 x 26) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Carrier, Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin-Lead |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Brass Alloy |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature: | -55°C ~ 125°C |
Image | Part Number | Description | Stock / Unit Price |
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48-6823-90Aries Electronics, Inc. |
CONN IC DIP SOCKET 48POS GOLD |
In Stock: 0 $19.00000 |
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614-43-318-31-002000Mill-Max |
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511-91-072-09-001003Mill-Max |
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614-91-322-31-012000Mill-Max |
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In Stock: 0 $13.86519 |
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104-13-324-41-780000Mill-Max |
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In Stock: 0 $32.88900 |
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44-6553-11Aries Electronics, Inc. |
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In Stock: 0 $24.66000 |