Type | Description |
---|---|
Series: | 550 |
Package: | Bulk |
Part Status: | Active |
Type: | BGA |
Number of Positions or Pins (Grid): | 576 (30 x 30) |
Pitch - Mating: | 0.050" (1.27mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Brass |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.050" (1.27mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Brass |
Housing Material: | FR4 Epoxy Glass |
Operating Temperature: | -55°C ~ 125°C |
Image | Part Number | Description | Stock / Unit Price |
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18-0518-11Aries Electronics, Inc. |
CONN SOCKET SIP 18POS GOLD |
In Stock: 0 $2.48600 |
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84-PRS13125-12Aries Electronics, Inc. |
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116-93-318-41-001000Mill-Max |
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In Stock: 0 $14.85803 |
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614-91-210-31-012000Mill-Max |
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551-10-072-11-061004Mill-Max |
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523-13-073-11-042001Mill-Max |
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In Stock: 0 $42.06020 |
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515-91-128-13-041001Mill-Max |
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In Stock: 0 $15.83560 |
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515-91-072-11-042001Mill-Max |
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In Stock: 0 $14.74080 |
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28-3513-11HAries Electronics, Inc. |
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In Stock: 0 $10.88000 |
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110-43-636-61-105000Mill-Max |
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