| Type | Description |
|---|---|
| Series: | 510 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | 208 (17 x 17) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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115-41-420-41-003000Mill-Max |
CONN IC SKT DBL |
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522-13-100-10-000002Mill-Max |
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126-43-324-41-003000Mill-Max |
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511-91-159-16-105001Mill-Max |
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37-0501-20Aries Electronics, Inc. |
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26-3513-10TAries Electronics, Inc. |
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317-91-118-41-005000Mill-Max |
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40-8800-610CAries Electronics, Inc. |
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