Type | Description |
---|---|
Series: | 605 |
Package: | Tube |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 22 (2 x 11) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Carrier, Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin-Lead |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Brass Alloy |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature: | -55°C ~ 125°C |
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515-93-088-12-052002Mill-Max |
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32-1518-10TAries Electronics, Inc. |
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In Stock: 0 $3.85054 |
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523-13-088-13-062002Mill-Max |
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515-91-073-11-061001Mill-Max |
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14-C280-30Aries Electronics, Inc. |
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511-91-088-12-052003Mill-Max |
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20-3508-211Aries Electronics, Inc. |
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410-93-264-41-001000Mill-Max |
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