Type | Description |
---|---|
Series: | 0503 |
Package: | Bulk |
Part Status: | Active |
Type: | SIP |
Number of Positions or Pins (Grid): | 2 (1 x 2) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | - |
Termination: | Wire Wrap |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Brass |
Housing Material: | Polyamide (PA), Nylon, Glass Filled |
Operating Temperature: | - |
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510-93-069-11-061002Mill-Max |
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22-3503-21Aries Electronics, Inc. |
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32-C212-10HAries Electronics, Inc. |
CONN IC DIP SOCKET 32POS GOLD |
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40-6575-16Aries Electronics, Inc. |
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510-87-210-17-061101Preci-Dip |
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614-13-135-14-051012Mill-Max |
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614-91-432-31-002000Mill-Max |
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116-43-648-41-006000Mill-Max |
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511-91-223-18-098002Mill-Max |
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522-93-323-21-005003Mill-Max |
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