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| Type | Description |
|---|---|
| Series: | 605 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 28 (2 x 14) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Carrier, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin-Lead |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass Alloy |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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SKT PGA SOLDRTL |
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14-0518-10HAries Electronics, Inc. |
CONN SOCKET SIP 14POS GOLD |
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32-3553-16Aries Electronics, Inc. |
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48-6518-01Aries Electronics, Inc. |
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110-47-308-41-605000Mill-Max |
STANDRD SOLDRTL |
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14-C280-11Aries Electronics, Inc. |
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In Stock: 0 $5.04000 |
