Type | Description |
---|---|
Series: | 0517 |
Package: | Bulk |
Part Status: | Active |
Type: | SIP |
Number of Positions or Pins (Grid): | 6 (1 x 6) |
Pitch - Mating: | - |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole, Right Angle |
Features: | - |
Termination: | Solder |
Pitch - Post: | - |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Brass |
Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature: | - |
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20-3508-30Aries Electronics, Inc. |
CONN IC DIP SOCKET 20POS GOLD |
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210-88-636-41-101000Mill-Max |
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116-43-306-61-001000Mill-Max |
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