Type | Description |
---|---|
Series: | 57 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 48 (2 x 24) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature: | - |
Image | Part Number | Description | Stock / Unit Price |
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34-3503-30Aries Electronics, Inc. |
CONN IC DIP SOCKET 34POS GOLD |
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192-PGM17025-10Aries Electronics, Inc. |
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In Stock: 0 $17.91333 |
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In Stock: 0 $101.65800 |
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614-13-136-14-051001Mill-Max |
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In Stock: 0 $26.04160 |
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In Stock: 0 $12.22929 |
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In Stock: 0 $39.81120 |
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25-7700-10Aries Electronics, Inc. |
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