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18-6501-30

18-6501-30

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Manufacturer Part
18-6501-30
Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET 18POS TIN
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
5074
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:501
Package:Bulk
Part Status:Active
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):18 (2 x 9)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:200.0µin (5.08µm)
Contact Material - Mating:Phosphor Bronze
Mounting Type:Through Hole
Features:Closed Frame
Termination:Wire Wrap
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Phosphor Bronze
Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:-55°C ~ 125°C

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