Type | Description |
---|---|
Series: | 508 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 20 (2 x 10) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Wire Wrap |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Brass |
Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
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511-91-179-18-095002Mill-Max |
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110-83-306-41-105191Preci-Dip |
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APA-314-G-BSamtec, Inc. |
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20-4508-30Aries Electronics, Inc. |
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In Stock: 0 $9.92167 |
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XR2A-1625Omron Electronics Components |
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In Stock: 0 $3.07400 |
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122-13-328-41-801000Mill-Max |
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117-93-656-61-005000Mill-Max |
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110-83-642-41-105101Preci-Dip |
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