Type | Description |
---|---|
Series: | 57 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 44 (2 x 22) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Tin |
Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature: | - |
Image | Part Number | Description | Stock / Unit Price |
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511-93-068-10-041002Mill-Max |
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515-91-169-13-000001Mill-Max |
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In Stock: 0 $18.02560 |
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116-41-432-41-007000Mill-Max |
CONN IC SKT DBL |
In Stock: 0 $15.22517 |
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510-91-142-15-085002Mill-Max |
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In Stock: 0 $26.82600 |
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In Stock: 0 $6.41189 |
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410-91-224-10-002000Mill-Max |
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In Stock: 0 $12.89625 |
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28-8620-610CAries Electronics, Inc. |
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