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| Type | Description |
|---|---|
| Series: | 550 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | BGA |
| Number of Positions or Pins (Grid): | 400 (20 x 20) |
| Pitch - Mating: | 0.050" (1.27mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | FR4 Epoxy Glass |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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116-93-308-61-003000Mill-Max |
CONN IC SKT DBL |
In Stock: 0 $19.46700 |
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APA-632-G-NSamtec, Inc. |
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115-41-642-41-001000Mill-Max |
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14-8500-611CAries Electronics, Inc. |
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30-0518-00Aries Electronics, Inc. |
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179-PLS18038-12Aries Electronics, Inc. |
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