| Type | Description |
|---|---|
| Series: | 513 |
| Package: | - |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 40 (2 x 20) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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515-93-299-20-096003Mill-Max |
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511-91-169-13-000003Mill-Max |
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146-87-310-41-036101Preci-Dip |
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17-7750-10Aries Electronics, Inc. |
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18-81250-310CAries Electronics, Inc. |
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614-13-400-20-000001Mill-Max |
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326-93-164-41-001000Mill-Max |
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515-93-149-15-061003Mill-Max |
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