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| Type | Description |
|---|---|
| Series: | 550 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | BGA |
| Number of Positions or Pins (Grid): | 478 (26 x 26) |
| Pitch - Mating: | 0.050" (1.27mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | FR4 Epoxy Glass |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
127-43-428-41-002000Mill-Max |
CONN IC SKT DBL |
In Stock: 0 $16.28433 |
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515-91-136-14-051001Mill-Max |
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APA-316-T-PSamtec, Inc. |
ADAPTER PLUG |
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551-90-176-15-061005Mill-Max |
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550-10-114-13-062101Preci-Dip |
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10-8563-610CAries Electronics, Inc. |
CONN IC DIP SOCKET 10POS GOLD |
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510-83-177-15-061101Preci-Dip |
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