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28-6575-18

28-6575-18

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Manufacturer Part
28-6575-18
Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET ZIF 28POS TIN
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
6582
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:57
Package:Bulk
Part Status:Active
Type:DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:200.0µin (5.08µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:-

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