| Type | Description | 
|---|---|
| Series: | 508 | 
| Package: | Bulk | 
| Part Status: | Active | 
| Type: | DIP, 0.3" (7.62mm) Row Spacing | 
| Number of Positions or Pins (Grid): | 18 (2 x 9) | 
| Pitch - Mating: | 0.100" (2.54mm) | 
| Contact Finish - Mating: | Gold | 
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) | 
| Contact Material - Mating: | Beryllium Copper | 
| Mounting Type: | Through Hole | 
| Features: | Open Frame | 
| Termination: | Wire Wrap | 
| Pitch - Post: | 0.100" (2.54mm) | 
| Contact Finish - Post: | Tin | 
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) | 
| Contact Material - Post: | Brass | 
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled | 
| Operating Temperature: | -55°C ~ 105°C | 
| Image | Part Number | Description | Stock / Unit Price | 
|---|---|---|---|
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                                    10-0503-21Aries Electronics, Inc. | 
                                
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                                    06-3518-00Aries Electronics, Inc. | 
                                
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