Type | Description |
---|---|
Series: | 55 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 42 (2 x 21) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Nickel Boron |
Contact Finish Thickness - Mating: | 50.0µin (1.27µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Nickel Boron |
Contact Finish Thickness - Post: | 50.0µin (1.27µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature: | - |
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510-91-084-10-031003Mill-Max |
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523-93-085-13-081003Mill-Max |
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20-3508-302Aries Electronics, Inc. |
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26-7650-10Aries Electronics, Inc. |
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