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| Type | Description |
|---|---|
| Series: | 55 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 42 (2 x 21) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Nickel Boron |
| Contact Finish Thickness - Mating: | 50.0µin (1.27µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Nickel Boron |
| Contact Finish Thickness - Post: | 50.0µin (1.27µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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510-91-084-10-031003Mill-Max |
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19-0501-20Aries Electronics, Inc. |
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523-93-085-13-081003Mill-Max |
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In Stock: 0 $39.96640 |
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20-3508-302Aries Electronics, Inc. |
CONN IC DIP SOCKET 20POS GOLD |
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522-13-132-14-071003Mill-Max |
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26-7650-10Aries Electronics, Inc. |
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In Stock: 0 $14.54250 |
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ICA-632-STTSamtec, Inc. |
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116-41-324-41-006000Mill-Max |
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In Stock: 0 $13.38922 |
