| Type | Description |
|---|---|
| Series: | PLS |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA, ZIF (ZIP) |
| Number of Positions or Pins (Grid): | - |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS) |
| Operating Temperature: | -65°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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24-3572-10Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 24POS TIN |
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558-10-600M35-001104Preci-Dip |
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551-90-169-17-101003Mill-Max |
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110-91-320-61-001000Mill-Max |
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551-90-224-18-095003Mill-Max |
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In Stock: 0 $33.15760 |
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116-43-320-61-003000Mill-Max |
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In Stock: 0 $21.20850 |
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110-93-328-61-801000Mill-Max |
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In Stock: 0 $23.55446 |
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116-43-950-41-003000Mill-Max |
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In Stock: 0 $16.76696 |
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116-91-316-41-003000Mill-Max |
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In Stock: 0 $12.84860 |
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08-2501-31Aries Electronics, Inc. |
CONN IC DIP SOCKET 8POS GOLD |
In Stock: 0 $5.73619 |