Type | Description |
---|---|
Series: | 0503 |
Package: | Bulk |
Part Status: | Active |
Type: | SIP |
Number of Positions or Pins (Grid): | 25 (1 x 25) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | - |
Termination: | Wire Wrap |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Brass |
Housing Material: | Polyamide (PA), Nylon, Glass Filled |
Operating Temperature: | - |
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515-13-098-13-061001Mill-Max |
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614-93-072-11-042001Mill-Max |
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116-93-308-41-001000Mill-Max |
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132-PLS14016-12Aries Electronics, Inc. |
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In Stock: 0 $72.89500 |
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124-83-324-41-002101Preci-Dip |
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In Stock: 0 $2.58169 |
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515-91-240-17-061002Mill-Max |
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614-87-428-31-012101Preci-Dip |
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In Stock: 0 $1.37550 |
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110-13-950-61-001000Mill-Max |
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175-PGM16003-11HAries Electronics, Inc. |
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