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| Type | Description |
|---|---|
| Series: | 508 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 24 (2 x 12) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Wire Wrap |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
511-13-132-13-041001Mill-Max |
SKT PGA SOLDRTL |
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16-8250-310CAries Electronics, Inc. |
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121-11-422-41-001000Mill-Max |
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115-93-322-61-003000Mill-Max |
CONN IC SKT DBL |
In Stock: 0 $20.22296 |
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110-43-624-41-605000Mill-Max |
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551-10-072-11-042005Mill-Max |
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In Stock: 0 $34.84500 |
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550-80-084-13-081101Preci-Dip |
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In Stock: 0 $7.77151 |
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50-9513-10Aries Electronics, Inc. |
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